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Fracture Analysis - メーカー・企業と製品の一覧

Fracture Analysisの製品一覧

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Destructive analysis | Package opening (decapping)

Destructive analysis | Package opening (decapping)

Are you having trouble with decapping (resin opening, package opening), which is essential for failure analysis of ICs and semiconductors?

We offer package opening for ICs using copper (Cu) wires, silver (Ag) wires, and more, utilizing our uniquely developed method to minimize wire dissolution and damage. We also accept package opening for resin-sealed power modules, such as high-voltage and high-current components like IGBTs, which are difficult to open due to the high content of fillers.

  • Other contract services
  • Contract Analysis
  • Microcomputer

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Destructive analysis (material analysis, fracture surface analysis, FIB, TEM, etc.)

Destructive analysis (material analysis, fracture surface analysis, FIB, TEM, etc.)

We will conduct failure analysis of electronic components and observe and analyze the failure locations through material analysis.

Experts in various components such as semiconductors, cables and connectors, printed circuit boards, display devices like LCDs, power units, batteries, AC adapters, and memory will conduct failure analysis. - Perform semiconductor package resin opening, and estimate causes through observations using optical microscopes, emission microscopes, and scanning electron microscopy (SEM) with mechanical polishing. - From the perspective of material analysis, estimate causes through processing and observation using focused ion beam processing observation equipment (FIB-SEM), and observation using transmission electron microscopy (TEM) for material condition, foreign matter identification, surface/break analysis, etc. *For more details, please refer to the PDF document or feel free to contact us.*

  • Other contract services
  • Contract Analysis

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Destructive analysis | Power module package opening (decap)

Destructive analysis | Power module package opening (decap)

Are you having trouble with the resin opening of power modules such as IGBTs, which contain a high amount of filler in the package sealing resin for high voltage and large current components?

Power modules such as IGBTs (Insulated Gate Bipolar Transistors) for high voltage and large current components often contain a significant amount of fillers in the package sealing resin, making it difficult to open the resin. We can remove the package resin using chemical agents for internal observation and, depending on your requirements, conduct evaluations, analyses, and assessments of the internal components after opening. *Please provide a trial sample for opening in advance so we can confirm whether it can be opened (free of charge). *IGBT (Insulated Gate Bipolar Transistor) is a type of power semiconductor capable of high-speed switching for large power.

  • inverter
  • UPS/Uninterruptible Power Supply
  • Contract Analysis

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
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